New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. Prospects on Copper Plating Systems for Ultra-large Scale Integrated Circuits.
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1998
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.49.1180